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The 0.75mm pitch between electrodes,
the smallest in the industry for the crimping type,
has been achieved.
‘ FEATURE
| |
The conventional SSJ connector is further miniaturized.
This corresponds to high density mounting.
(Reduction in substrate occupy area is 20%
as compared with our products.) |
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Fully automatic terminal crimper (JN01SS II) permits
full automatic crimping of extra fine wire (AWG#36). |
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Launched
low-profile series with
double arm lock system,secure
mating structure
‘ FEATURE
| |
Unique design,double arm lock
system provides
outstanding workability,accordingly assures reliable connection |
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Vacuum area creates on the
vertical type wafer which can be helpful and direct
pick up the wafer during surface mounting process.
Nothing remove any of materials such as tape or
cover cap for picking up .
Assist your post-processing
as a de finitely environment- conscious product. |
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Box type structure prevents
mismating and withstand @rough mating |
|
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1.5mm
pitch SZT series connector
dramatically strengthen user-friendly
Insertion process realizes quite easy and completely
‘ FEATURE
| |
Low pro file design,only 7.9mm
height |
| |
Designed for PCB,SMT and
DIP available |
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Double arm lock system is
excellent advantage of mating work,@realizes
satisfactory level of reliability |
| |
Improves the sensitivity
of workability and operability |
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Polarized structure prevents
from being defective connection |
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